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ISBN-10: 1574981536

ISBN-13: 9781574981537

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Surely, these matters are problems which should not be avoided, when the interface design is considered. An adequate insert material is chosen, and the interfacial reaction is very often noticed. However, it should be recognized that the excessive interfacial reaction is a secondary phenomenon after the necessary bonding process. The numerical examination presented in the present study seems to be useful for discussing the necessary bonding process between ceramics and metals. If the effective model parameters are estimated and an adequate modification for reaction diffusion is carried out, the prediction of the bonding for complex dissimilar materials are possible, using the method described.

Nishiguchi, "Determination of Optimum Process Conditions in Solid Phase Bonding by a Numerical Model," Welding in the World, (Trans. HW), 27,[3/4],100-113(1989). 6) Y. Takahashi, S. Aono, T. Kamitani, K. Inoue, and K. Nishiguchi, " Development of Estimation Method of Void Spacing Distribution during Bonding and Modelling Interface Contact Process," Quarterly J. JPN Weld. , 14 [4], 666-673 (1996). 7) Y. Takahashi, K. Miki and K. Inoue, " Prediction Algorithm of Solid State Diffusion Bonding in the Case When Material Constants Are Unknown," Transaction of JWRI, 24, [2], 27-36 (1995).

The radius r is calculated from the assumption of VR = VL (see Fig. 1 (c)) and the rate of change of the void height h was calculated from the volume conservation by dh/dt = -hX/(L+X). Equations (l)-(4) were originally applied for the diffusion bonding of similar materials 4» 5 \ When these equations are applied to dissimilar material bonding, it is very important to use the proper model parameters such as tt, A0, G, Db,Dv, Q, and Sb**). The interdiffusion between dissimilar materials is necessary to estimate these parameters.

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